Assembly

We provide a full range of assembly for plastic and ceramic packages, metal cans, RF modules and power management modules. Major assembly processes include dicing, die sorting, epoxy or eutectic die attach, die coating, gold or aluminum wire bonding, BeO or substrate attach through furnace, plastic encapsulation, can welding, leak tests, lead finish using solder plate or solder dip, singulation and lead forming.

Testing

We provide final test services which include 100% DC electrical testing, 100% or sampling RF testing, laser or ink marking (branding), packing in carrier tapes, shipping tubes, trays or bulk-packed according to customers' requirements.

RF Testing Capabilities

We perform small signal gain and noise figure testing for RF discrete devices in a RF screened room facility. We also perform power gain, efficiency, signal flatness and insertion loss testing for RF products ranging from low power discrete devices to high power RF modules. These are supported by in-house engineering capabilities to construct RF text fixtures according to customers' test circuits.

Miniature RF Transformer Construction

We produce miniature transformers of various construction configurations for various RF applications. Single, bifilar, trifilar or twisted wires are wound on ferrite beads or binocular cores of various sizes. Wire leads are then twisted, trimmed to specified lengths and solder-tinned to 40-50 mils length to facilitate assembly.

We also produce surface-mount version of miniature RF transformers assembled in ceramic caps.