We provide fully automated one-stop die sorting using inked dot, wafer mapping and packing services. The processes include dicing (die saw), sorting, binning and packing into waffle packs. Our current processes can cater for 3-inch to 6-inch wafers of die size ranging from 10x10 mils to 250x350 mils. Waffle trays of custom-sized pocket dimensions are sourced locally in Malaysia or provided by respective customers.